Even the all-powerful Pointing from the countries Vokalia and Consonantia, there live the blind texts. Separated they live in Bookmarksgrove right at the coast of the Semantics, a large language ocean. A small river named Duden flows by their place and supplies.
The copy warned the Little Blind Text, that where it came from it would have been rewritten a thousand times and everything that was left from its origin would be the word "and" and the Little Blind Text should turn around and return to its own, safe country. But nothing the copy said could convince her and so it didn’t take long until a few insidious Copy Writers ambushed her, made her drunk with Longe and Parole and dragged her into their agency, where they abused her for their projects again and again. And if she hasn’t been rewritten, then they are still using her. Far far away, behind the word mountains, far from the countries Vokalia and Consonantia, there live the blind texts. Separated they live in Bookmarksgrove right at the coast of the Semantics, a large language ocean.
Humidity plays a bit part when working within electronic circuit boards assembly industry. We keep relative humidity levels between 40 – 60% to ensure electrostatic build-up is kept to minimum and circuit boards that are exposed to environment during procedures adsorb moisture at the lowest rate. By monitoring relative humidity we take control of environment and reduce defect levels whilst improving our soldering profiles and solder paste efficiency. All humidity fluctuations are recorded and acted upon to identify causes and develop corrective action plans, which eliminates potential errors in further stages.
ENVIRONMENTAL LABORATORIES
COMPONENT PRE-BAKING
“Successful BGA reballing application consist correct prebaking procedure. As the component temperature has to be rapidly raised to over 200C, typical pre-baking process of 8-24h at 125C is used to ensure all trapped moisture is eliminated.”
RE-BALLING PROCESS
“Old residual solder is removed, BGA site inspected and prepared to take new solder spheres. Alloy and RoHS requirements are determined by customer. Component is subjected to controlled thermal profile to attach new solder to BGA pads.”
QUALITY CONTROL
“Re-balled components are checked for sphere condition using electronic magnification. Other verification methods such as ball shear, solder-ability, coplanarity and functional tests are available.”