During extensive experience dealing with obsolete components our rework laboratory engineers are capable of re-balling any long-lead time or hard to find BGA parts. Constant innovation in component recovery processes allows us to provide safest and value orientated rework procedures for our worldwide customer network. We aim to become market leader in safest BGA and QFN component recovery procedures by sustaining a competitive advantage through our reliability, total quality commitment and our constant efforts to exceed client expectations.

High reliability PCBA applications opt out to use lead based solder alloys for various reasons, such as whisker mitigation, voids, lead-free micro cracks and improved flexibility when it comes to high density BGA sites. Within our ESD-safe soldering laboratories we have developed non-destructive processes to fully convert Pb-Free Ball Grid Array components to lead based solder compositions. All RoHS converted integrated circuits are statistically documented and pass our post-rework quality, functional and electrical tests under customer requests.

Most of Printed Circuit Board Assembly facilities are well acquainted with post-manufacturing rework challenges. BGA rework could be a high investment and expertise project, which can be inefficient on low volumes of PCB rework. Issues identified by Automated Inspection Systems can usually repaired manually by in-house operators. Our services offer BGA reballing and refurbishing of incorrectly soldered BGA components to EMS providers, so that components can be introduced back into manufacturing or rework process.